SUZHOU FOISONS ELECTRONIC TECHNOLOGY CO.,LTD/Boss Stand-off/EMI Clips (Spring)/EMI Shielding can/Graphite

For a long time, engineers are difficulties overcoming the problem of EMI in production. Therefore, we have been devoted to R&D of EMI clip, and paid special attention to complying with intellectual property rights. Our products have been patented in different countries, including the followings:

	S-type I
	☆ Even pressure amplitude ☆ Surface contact: large area, excellent conductivity and EMI ☆ Lower limit block plate to set the lowerpressure limit. ☆ Contact resistance coefficient 0.23mΩ ☆ Customized plate of Sn or Au ☆ Customized materials, height, and PAD ☆ Difference in height on the bottom to prevent overflow and impact on the elasticity.

	S-type II
	☆ Even pressure amplitude ☆ Surface contact: large area, excellent conductivity and EMI ☆ Lower limit block plate to set the lower pressure limit. ☆ Contact resistance coefficient 0.23mΩ ☆ Customized plate of Sn or Au ☆ Customized materials, height, and PAD ☆ Difference in height on the bottom to prevent overflow and impact on the elasticity.

	S-type III
	☆ Even pressure amplitude ☆ Surface contact: large area, excellent conductivityand EMI ☆ Lower limit block plate to set the lower pressure limit. ☆ Contact resistance coefficient 0.23mΩ ☆ Customized plate of Sn or Au ☆ Customized materials, height, and PAD ☆ Difference in height on the bottom to prevent overflow and impact on the elasticity. S-type III

	L-type
	☆ Even pressure amplitude ☆ Surface contact: large area, excellent conductivity and EMI ☆ Lower limit block plate to set the lower pressure limit. ☆ Contact resistance coefficient 0.23mΩ ☆ Customized plate of Sn or Au ☆ Customized materials, height, and PAD ☆ Difference in height on the bottom to prevent overflow and impact on the elasticity.

	D-type
	☆ Even pressure amplitude ☆ Surface contact: large area, excellent conductivity and EMI ☆ Lower limit block plate to set the lower pressure limit. ☆ Contact resistance coefficient 0.23mΩ ☆ Customized plate of Sn, OR or Au ☆ Customized materials, height, and PAD ☆ Difference in height on the bottom to prevent overflow and impacton the elasticity.